Potting Compound 85 is a highly filled heat-curing system designed for use in electronic and microcircuit packaging. It is exceptionally fluid, can be handled easily at room temperature, cures in a relatively short time and has excellent electrical properties at high temperatures. Because Potting Compound 85 uses a liquid anhydride curing agent, it usually can be used over semiconductor junctions without causing poisoning failure. The costly step of protecting chips with silicone rubber barrier coatings can be eliminated in many applications.
Freeze Pak: 98185
Potting Compound 103 is a filled undiluted epoxy system with good resistance to impact and will cure at moderate temperatures. This system is recommended for potting devices such as connector shells from which wires may protrude directly through the epoxy. It adheres well to insulated wires. This system is available in a number of colors.
Freeze Pak: 99956
Potting Compound 124C Natural is a highly filled epoxy compound featuring low coefficient of thermal expansion, high strength and low creep. These are high performance materials useful in applications requiring high dimensional stability (especially at elevated temperatures), high strength, and outstanding resistance to outgassing in applications such as gyro motors and electromechanical devices operating in extreme environments.
Freeze Pak: N/A
Potting Compound 182A is a highly filled high performance epoxy system featuring relatively low viscosity along with very low shrinkage stress, low coefficient of thermal expansion, high strength, high modulus of elasticity and excellent thermal shock resistance. This material is useful in applications requiring high dimensional stability and for low outgassing in end uses such as gyro motor stators, electromagnetic devices and precision electronic devices operating in extreme environments.
Freeze Pak: 98181A