Compound 85 | Compound 103 | Compound 124C Natural | Compound 182A | CPE-1512 | CPE-1517 | CPE-1530 | CPE-1534
Compound 85
Potting Compound 85 is a highly filled heat-curing system designed for use in electronic and microcircuit packaging. It is exceptionally fluid, can be handled easily at room temperature, cures in a relatively short time and has excellent electrical properties at high temperatures. Because Potting Compound 85 uses a liquid anhydride curing agent, it usually can be used over semiconductor junctions without causing poisoning failure. The costly step of protecting chips with silicone rubber barrier coatings can be eliminated in many applications.
Resin: 91385
Activator: 97062
Freeze Pak: 98185
Compound 103
Potting Compound 103 is a filled undiluted epoxy system with good resistance to impact and will cure at moderate temperatures. This system is recommended for potting devices such as connector shells from which wires may protrude directly through the epoxy. It adheres well to insulated wires. This system is available in a number of colors.
Resin: 91403
Activator: 97099
Freeze Pak: 99956
Compound 124C Natural
Potting Compound 124C Natural is a highly filled epoxy compound featuring low coefficient of thermal expansion, high strength and low creep. These are high performance materials useful in applications requiring high dimensional stability (especially at elevated temperatures), high strength, and outstanding resistance to outgassing in applications such as gyro motors and electromechanical devices operating in extreme environments.
Resin: 91424CN
Activator: 97042
Freeze Pak: N/A
Compound 182A
Potting Compound 182A is a highly filled high performance epoxy system featuring relatively low viscosity along with very low shrinkage stress, low coefficient of thermal expansion, high strength, high modulus of elasticity and excellent thermal shock resistance. This material is useful in applications requiring high dimensional stability and for low outgassing in end uses such as gyro motor stators, electromagnetic devices and precision electronic devices operating in extreme environments.
Resin: 91482A
Activator: 97182
Freeze Pak: 98181A
CPE-1512
Potting Compound CPE-1512 is a highly filled heat-curing system designed for use in electronic and microcircuit packaging. It is exceptionally fluid, can be handled easily at room temperature, cures in a relatively short time and has excellent electrical properties at high temperatures. Because Potting Compound CPE-1512 uses a liquid anhydride curing agent, it usually can be used over semiconductor junctions without causing poisoning failure. The costly step of protecting chips with silicone rubber barrier coatings can be eliminated in many applications. Bacon Industries’ Potting Compound 85 has been labeled, packaged, tested and certified for aerospace applications.
Resin: 201512
Activator: 101129
strong>Freeze Pak: 1512129
CPE-1517
Potting Compound CPE-1517 is a filled undiluted epoxy system with good resistance to impact and will cure at moderate temperatures. This system is recommended for potting devices such as connector shells from which wires may protrude directly through the epoxy. It adheres well to insulated wires. This system is available in a number of colors. Bacon Industries’ Potting Compound 103 has been labeled, packaged, tested and certified for aerospace applications.
Resin: 201517
Activator: 101138
Freeze Pak: 1517138
CPE-1530
Potting Compound CPE-1530 is a highly filled epoxy compound featuring low coefficient of thermal expansion, high strength and low creep. These are high performance materials useful in applications requiring high dimensional stability (especially at elevated temperatures), high strength, and outstanding resistance to outgassing in applications such as gyro motors and electromechanical devices operating in extreme environments. Bacon Industries’ Potting Compound 124C Natural has been labeled, packaged, tested and certified for aerospace applications.
Resin: 201530
Activator: 101118
Freeze Pak: 1517118
CPE-1534
Potting Compound CPE-1534 is a highly filled high performance epoxy system featuring relatively low viscosity along with very low shrinkage stress, low coefficient of thermal expansion, high strength, high modulus of elasticity and excellent thermal shock resistance. This material is useful in applications requiring high dimensional stability and for low outgassing in end uses such as gyro motor stators, electromagnetic devices and precision electronic devices operating in extreme environments. Bacon Industries’ Potting Compound 182A has been labeled, packaged, tested and certified for aerospace applications.
Resin: 201534
Activator: 101143
Freeze Pak: 1534143